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High-level HDI board12L
High-level HDI board12L
▪ Product Name: 12-Layer 3-Level HDI Board▪ Number of layers: 12 layers▪ Material: TU872▪ Aspect ratio: 6:1▪ Finished product thickness: 1.2mm▪ Minimum hole diameter: laser hole 0.1mm, mechanical hole 0.2mm▪ Line width/line spacing: 2.6mil/2.6mil▪ Technical points: 3+N+3,...
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High-level HDI board12L
High-level HDI board12L
▪ Layers:12L ▪ Board thickness:0.8mm ▪ Material:EM-370 ▪ Min Width/Spacing:60/60um ▪ Surface treament:ENIG+OSP
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High-level HDI board8L
High-level HDI board8L
▪ Number of layers: 8 layers▪ Material: S1000-2▪ Aspect ratio: 8:1▪ Finished product thickness: 1.2mm▪ Minimum hole diameter: laser hole 0.1mm, mechanical hole 0.15mm▪ Line width/line spacing: 3mil/4mil▪ Technical points: 2+N+2, through-hole plate with holes, minimum BGA d...
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High-level HDI board16L
High-level HDI board16L
▪ Layers -- 16Layer ▪ Material -- PanasonicR-5775 ▪ Thickness --2mm ▪ Inner copper -- HOZ ▪ Min line width/spacing -- 2/2mil ▪ Min Aperture --0.1mm ▪ Surface Treament- ENIG ▪ Application --Communication Equipmet
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High-level HDI board24l
High-level HDI board24l
▪ Number of layers: 24L▪ Material: FR-4 (Tg180) VT-47▪ Plate thickness: 2.59+/-0.26mm▪ Minimum line width/line spacing: 3.5/5.0 mil▪ Minimum hole diameter: 0.25mm▪ Surface treatment: Immersion gold plating
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High-Multilayer Board10L
High-Multilayer Board10L
▪ Number of layers: 10L▪ Product Model: 400Gbps QSFP-DD▪ Material: M6(R-5775)▪ Thickness tolerance of finished product: Gold finger area 1.0 ± 0.075mm▪ Plug shape tolerance: ±0.05mm▪ Hole filling depression: <15μm▪ Surface treatment: Immersion nickel-palladium gold + el...
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High-Multilayer Board34L
High-Multilayer Board34L
▪ Number of layers: 34L▪ Material: FR408HR ▪ Board thickness: 4.0mm ▪ Copper thickness of inner and outer layers: 10Z ▪ Surface treatment: ENIG
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High-Multilayer Board26L
High-Multilayer Board26L
▪ Number of layers: 26 layers▪ Material: Tachyon 100G▪ Thickness: 3.5 ± 0.35 mm▪ Inner copper thickness: 0.330Z▪ Minimum line width/line spacing: 0.112/0.05 millimeters▪ Minimum aperture: 0.225 mm▪ Surface treatment: immersion gold plating▪ Application field: Switch
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Heavy Copper Board10L
Heavy Copper Board10L
▪ Number of layers - 10L▪ Material - TU865▪ Plate thickness - 3.5mm▪ Copper thickness of inner and outer layers - 5OZ▪ Minimum line width/line spacing - 2/2mm▪ Minimum hole diameter - 0.7mm▪ Surface treatment - immersion gold ▪ Application field - communication equipment
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Heavy Copper Board10L
Heavy Copper Board10L
▪ Industrial control system ▪ Number of layers - 10L▪ Material - EM-370(Z)▪ Plate thickness - 2.48mm▪ Copper thickness of inner and outer layers - 4 oz (RTF)▪ Minimum line width/line spacing - 0.433/0.137mm▪ Minimum hole diameter - 0.3mm▪ Surface treatment - immersion gol...
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Heavy Copper Board10L
Heavy Copper Board10L
▪ Number of layers - 10L▪ Material - EM-827▪ Plate thickness - 4.85mm▪ Copper thickness of inner and outer layers - 3 oz▪ Minimum line width/line spacing - 0.45/0.30mm▪ Minimum hole diameter - 0.25mm▪ Surface treatment - immersion gold plating
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Rigid-Flex PCB8L
Rigid-Flex PCB8L
▪ Layer count--8L▪ Material --High TG FR-4+PI▪ Board thickness --1.0±0.1mm▪ Min.LW/LS--0.10/0.10mm▪ Min.Drill Size --0.1mm▪ Surface Finish--ENIG
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