Runmtek is a manufacturer specializing in IC substrates, high-step HDI, high-layer count, special-process printed circuit boards.

We remain committed to continuous investment in the process R&D and manufacturing of IC substrates, high-difficulty PCBs, FPCand R-FPC products. By introducing advanced printed circuit board production equipment and adopting cutting-edge manufacturing capabilities such as MSAP, ETS, and SAP, we meet the substrate requirements for packaging applications including RF module chips, memory chips, application processor chips, and high-performance computing chips.

The products include IC substrates, MEMS substrates, high-step HDI to anylayer HDI, and high-layer count (4-60) PCB/FPC/rigid-flex boards, special process PCB (high-frequency/speed，hybrid pressing, deep micro-vias, stepped gold fingers, long and short gold fingers, copper paste plugged holes, POFV, back drilling, semi-holes, metal edge coating, mechanical blind/buried holes, controlled-depth drilling/blind milling, localized thick copper, thick copper HDI, BGA selective plating process, stepped slots, etc.). These products are widely used in communication equipment, artificial intelligence, automotive electronics, consumer electronics, industrial control, medical electronics, semiconductors, LED lighting, and other fields, with customers spread across North America, Europe, China, and the Pacific Rim region.

To meet customers' personalized and diversified needs, we invested in building an SMT soldering factory equipped with advanced patch processing production lines, catering to various motherboard patch processing requirements. This enables one-stop services such as PCB fabrication, soldering, and component procurement, supporting clients throughout the entire process from sample production to mass manufacturing. By doing so, we help reduce management costs and enhance the efficiency of product development and production.