Rigid-Flex PCB, in simple terms, refers to an integrated circuit board that combines a "rigid board (rigid PCB)" and a "flex board (FPC)".It is not a mere assembly of "rigid board, flex cable, and connector", but rather a unified whole formed through the same material system and ...

As the core carrier of advanced packaging, the IC carrier board's core process difficulties are concentrated in three dimensions: high-precision manufacturing, material adaptability, and yield control. These difficulties are specifically reflected in the following key aspects...

The core challenges of microvia processing for high-level HDI boards lie in achieving smaller via diameters, high precision in via placement, controllable via wall quality, and balancing yield in mass production. To overcome these challenges, it is necessary to approach from four...

Accurately match materials to reduce interlayer stress from the sourceHigh-level HDI boards are mostly multi-layer structures, composed of core boards, prepreg (PP), and other different materials laminated together. The mismatch in coefficient of thermal expansion (CTE) is the co...

Accurately matching materials can reduce the difficulty of interface adaptation from the source. The hard part of the rigid-flex board is mostly made of FR-4 and BT resin, while the soft part is made of polyimide (PI) substrate and copper foil. The interlayer bonding relies on pr...

Overcome the difficulty of poor precision in window opening boundaries: precise positioning, controllable processingAny deviation in the window opening boundary or dimensional discrepancy can lead to insufficient effective bending area in the flexible zone, or failure of protecti...

Introduction to immersion gold thickness of circuit board1. Introduction to immersion gold plating process for circuit boardsThe immersion gold process, also known as Electrolytic Gold (Electrolytic Gold Deposition), involves depositing a uniform layer of metal produced through e...