Pilot Prod

Mass Prod

Pilot Prod

Mass Prod

Laminate Suppliers

-

Shengyi，EMC，ITEQ, Doosan，NOUYA

Laminate Type

-

FR4，BT，High speed (Low Dk、Low Df) 、 Tg150/Tg170 /Tg230

Core Thickness(Min)

mm

0.04

0.05

0.04

0.05

Prepreg Insulation Layer(Min)

-

1017（25um）

1017（28um）

1010

1017

Min Board Thickness (10-Layer)HDI

mm

0.46

0.5

0.46

0.47

Min Board Thickness (12-layer)HDI

mm

0.528

0.57

0.528

0.55

Layer Count

-

2-30L

2-24L

2-36L

2-30L

HDI Structure

-

26 ELIC

1 N 1 ~16 ELIC

26 ELIC

1 N 1 ~20 ELIC

Min. hole size mech. via (Min)

mm

0.10

0.15

0.10

0.15

Min. hole size Laser Drilling - CO2 (Min)（CO2）

mm

0.050

0.065

0.050

0.065

Aspect Ratio (Blind Via)

-

1:1

0.8:1

1:1

0.8:1

Aspect Ratio (Mech. Via)

13:1

10:1

18:1

13:1

Min LW/LS

um

25/25

25/40

20/25

25/30

Impedance Tolerance

-

±5%

±7%

±5%

±7%

Plating Variation

-

±8%

±10%

±6%

±8%

Min BGA Pad Diameter

mm

0.11

0.15

0.15

0.19

Min BGA Pitch

mm

0.30

0.325

0.30

0.325

Solder Mask Registration Tol.

mm

±0.025

±0.025

±0.025

±0.025

Min Solder Mask Dam (Green/Black ink)

mm

0.05

0.063

0.05

0.05

Surface Finishes

-

ENIG, ENEPIG, Hard Gold, Soft Gold, Immersion Tin, OSP，OSP ENIG