Item

2026

2027

Sample

Mass Production

Sample

Mass Production

Layers

52

50

62

60

Max Board Thickness (mm)

10

8

10

10

Min Board Thickness (mm)

0.5

0.5

0.5

0.5

Panel Size (mm)

620×1200

620×920

620×1200

620×1200

Min & Max Base Copper Thickness (oz)

Hoz/6oz

Hoz/6oz

Hoz/6oz

Hoz/6oz

Min Core Thickness (μm)

50

50

50

50

Inner Layer Min Line Width/Space (μm)

66/76

76/76

66/76

76/76

Outer Layer Min Line Width/Space (μm)

76/76

76/76

76/76

76/76

Min Copper Pad Size (mm)

0.35

0.35

0.35

0.35

Min BGA Pitch (mm)

0.4

0.5

0.4

0.5

Drilling - Min Mechanical Hole Diameter (mm)

0.15

0.15

0.15

0.15

Drilling - Min Laser Hole Diameter (mm)

0.1

0.1

0.075

0.1

Min Press-Fit Hole Tolerance (mm)

±0.05

±0.05

±0.05

±0.05

Back Drill to Copper (mm)

0.11

0.125

0.11

0.125

Back Drill Stub (mm)

0.125±0.075

0.15±0.1

0.125±0.075

0.15±0.1

Aspect Ratio - Mechanical Hole φ0.15mm

20:1

16:1

20:1

16:1

Aspect Ratio - Mechanical Hole φ0.2mm

23:1

20:1

23:1

20:1

Impedance Tolerance - Inner Layer

±5%

±8%

±5%

±8%

Impedance Tolerance - Outer Layer

±8%

±10%

±8%

±9%

Resin Plugging (Vacuum) - Min Plugged Hole Diameter (mm)

0.15

0.2

0.15

0.2

Resin Plugging (Vacuum) - Max Aspect Ratio for φ0.2mm Hole

14:1

12:1

14:1

12:1

Solder Mask - Green Oil Alignment (μm)

±25

±35

±25

±35

Solder Mask - Min Green Oil Bridge (mm)

0.064

0.075

0.05

0.075

Solder Mask Plugging Aspect Ratio

14:1

12:1

14:1

12:1

Warpage

≤0.5%

≤0.5%

≤0.3%

≤0.5%

Surface Finish

ENIG, OSP, HASL, Immersion GoldOSP, Immersion Tin, G/F

OSP, G/F, Immersion Gold