What is the appropriate thickness of immersion gold for circuit boards

Introduction to immersion gold thickness of circuit board

1. Introduction to immersion gold plating process for circuit boards

The immersion gold process, also known as Electrolytic Gold (Electrolytic Gold Deposition), involves depositing a uniform layer of metal produced through electrolysis onto the surface of a fabricated board. This process is completed with an organic protective agent to ensure complete coating and a smooth surface.

Immersion gold plating is a protective gold plating process that exhibits excellent solder reliability, corrosion resistance, and electrical performance. The color of the immersion gold layer is golden yellow, presenting a luxurious appearance. It is commonly used in high-demand applications such as communication equipment and computer motherboards.

II. Introduction to the thickness of immersion gold on circuit boards

The thickness of immersion gold refers to the thickness of the gold plating layer, which directly affects the performance of the immersion gold layer. Generally speaking, the thickness of immersion gold ranges from 0.03 to 0.125 micrometers.

Excessively thick immersion gold can lead to metal porosity, resulting in issues such as insufficient solder joint strength or blackening. Conversely, an overly thin immersion gold layer may not meet the requirements of some demanding applications.

III. Considerations for selecting immersion gold thickness

1. Taking the actual application environment into account, determine the thickness of immersion gold based on actual requirements.

2. Different immersion gold processes require different immersion gold thicknesses.

3. When extending a circuit board over a large area, the thickness of the immersion gold layer should not be too thick, otherwise it may cause uneven wiring.

4. Ensuring the uniformity and integrity of the immersion gold layer is a crucial factor in guaranteeing its performance.

IV. Summary

Immersion gold plating is a commonly used PCB surface treatment technique, with a thickness ranging from 0.03 to 0.125 micrometers. The selection of an appropriate immersion gold thickness should be based on actual requirements. During the immersion gold plating process, it is important to ensure that the immersion gold layer is uniform and intact.