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Rigid-Flex PCB14L
Rigid-Flex PCB14L
▪ Layer count--14L▪ Material --High TG FR-4+Flex▪ Board thickness--1.6±0.16mm▪ Min.LW/LS--0.10/0.10mm▪ Min.Drill Size --0.15mm▪ Surface Finish--ENIG
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5G High-Speed Products22L
5G High-Speed Products22L
▪ 22 Layer PCB▪ High Speed Low Loss▪ 2 Lam-L22-3 and L1-22▪ 11 Sets of Back Drill,VIPPO▪ 20 T-Coins 22-3/3-1▪ 10 set of CI Single/Diff▪ HVLP Copper
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LED Substrate AIO2L
LED Substrate AIO2L
▪ Layer--2L▪ Material --Al2O3▪ Thickness --1.2mm▪ Copper --35um▪ Finishing --ENEPIG
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High Speed PCB26L
High Speed PCB26L
▪ Layer count-26L▪ Material -Tachyon 100G▪ Board Thickness --3.5±0.35mm▪ Copper thickness --0.33OZ▪ Min.LW/LS-0.118/0.051mm.Min▪ hole Size --0.225mm▪ Surface Finish --ENIG▪ Application field-Industrial Control
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3W LED Aluminum1L
3W LED Aluminum1L
▪ Layer--1L▪ Material --VT4B9▪ Thickness --1.524mm▪ Copper --140um▪ Finishing --LF-HASL
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Single Copper base1L
Single Copper base1L
▪ Layer--1L▪ Material --Copper Base▪ Thickness --1.6mm▪ Copper --70um▪ Finishing --ENING
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HF Antenna Board2L
HF Antenna Board2L
▪ Number of layers: 2L▪ Material: Doosan DS-7409DV▪ Plate thickness: 0.6mm ± 10%mm▪ Minimum line width/line spacing: 0.580 ± 5% mm▪ Minimum hole diameter: 0.2mm▪ Surface treatment: immersion tinning
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PCBACommunication equipment
PCBACommunication equipment
▪ Patch points: 1134▪ Types of components: 141▪ PCB size: 192*182mm▪ Min package size of resistors: 0201▪ Min device pin pitch: 0.45▪ Welding method: Double-sided reflow soldering +DIP
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PCBAIndustrial control board
PCBAIndustrial control board
▪ Patch points: 1435▪ Types of components: 116▪ PCB size: 200*105mm▪ Min package size of resistors: 402▪ Min device pin pitch: 0.5▪ Welding method: Double-sided reflow soldering + wave soldering
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PCBAIC test board|SMT
PCBAIC test board|SMT
▪ Patch points: 1630▪ Types of components: 78▪ PCB size: 240*200mm▪ Min package size of resistors: 0402▪ Min device pin pitch: 0.4▪ Welding method: Double-sided reflow soldering + wave soldering
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