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倒装芯片球栅格阵列
倒装芯片球栅格阵列
Product Model：FCBGA
Product Description：
▪ 层数——8L 3+2+3
▪ 材料——MCL-E-705G+ABF GL102
▪ 板厚——0.76mm
▪尺寸——50*50 mm
▪ 内外层铜厚——17um
▪最小线宽/线距——10/10 um
▪最小孔径——50um
▪ 表面处理——IT+SOP
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