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应用处理基带芯片
应用处理基带芯片
Product Model：AP/FCCSP
Product Description：
◆ Structure : 2L,Total thickness170 μm, core thickness 100μm;
◆ MSAP process，L/S=20/20μm
◆ 75μm laser dirlled “X” hole ，copper filled.Bonding finger Pitch: 95μm(50/40μm)BOL Pitch: 55μm(25/30μm)
◆ Surface finish:Soft Ni/Au+OSP +Etch-back
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AP/FCCSP应用处理基带芯片
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