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应用处理基带芯片
应用处理基带芯片
Product Model：AP/FCCSP
Product Description：
◆ Structure : 6L, 2+2+2,Total thickness 400 μm, core thickness 150μm;Inner layer: 75μm laser dirlled“X” hole ,copper filled. Outer layer:60μmlaser blind via.
◆ Fine line: inner layerMSAP process,L/S=15/15 μm.
◆ AUS SR1/thickness 15+/-7μm，SRO=105μm，SM shift tolerance≤15μm.
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