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存储类芯片
存储类芯片
Product Model：SSD
Product Description：
◆ Structure: 2L，Total thickness:100 μm min;Mechanical Drilling，Filled Via with SM;Laser Drilling，Filled Via with Copper, dimple≤5μm;
◆ Tenting process，L/S≥35/35um;MSAP process,L/S≤25/25μm;
◆ SM colour: Green or Black matte /thickness 20+/-7μm,SM Flatness≤7μm;
◆ Surface finish: AFOP(TOP:Ni/Au, BTM: OSP)
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