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射频模组
射频模组
Product Model：RF
Product Description：
◆ Structure: 4L，1+2+1，Total thickness:180μm min;
◆ Layer alignment: blind via ring width 25μm，Adjacentlayer shift≤25μm，Random layer shift≤40μm
◆ MSAP process，trace width tolerance ±5μm ;
◆ Surface finish: Thin ENEPIG ( Ni thickness 0.3~0.5μm)
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